Asia Silicon Valley

Commercialization Program for Semiconductor Devices Performance Enhancement Technology

Principal Investigator:Ting-Chang Chang


After fabrication process of epitaxy, etching, and ion implantation etc., various type of material defects will appear in semiconductor devices, which will affect devices seriously. A conventional solution toward this is by thermal annealing. However, after the fabrication process of metallization in semiconductor devices, the process temperature is required to be lower than 400oC, leading to limit the improvement by using thermal annealing. Wedevelop a new technology which allows us to eliminate material defects under low temperature(<300oC). The improvementson device characteristic of various basis materials such as silicon, GaN, SiC, etc., are all significant. For example, this technology can effectively improve the FET’s conduction current with lower subthreshold swing.As for light emitted diode (LED), this technology can increase theluminous efficiency with lower operation voltage.


  1. Original innovation withgoodpatent portfolio.
  2. Low process temperature (<300oC).
  3. Compatible withthe existing fabrication process
  4. 4.Significant enhancements on several kindsof devices
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Team Introduction

Vision:Be a leader in performance enhancement of semiconductor devices with inno-vation technology.

Values and Business Philosophy: EXCELLENCE – in all that we do, WIN – with our customers.

Core members: Professor T.C. Chang is the primary developer of this new technology. He is proficient in nano device physics, semiconductor devices process, and has long been cooperating with semiconductor and display manufactures in Taiwan. Professor Chang’s laboratory can provide deep deceives analyze and solution advices, helping companies to overcome technology bottleneck. Therefore, his lab has a well relationship with semiconductor companies in Taiwan. The postdoctoral researcher in the team have devoted to develop in this technology for eight years since studying in master. The CEO is familiar with theB2B business development. He had participated in the startup company and the developing experience of new BU.

Team advantages: (1) Team members have good relationships with semiconductormanufactureswho are potential customers. (2) Extensive experience in the field

Goals and Plan
Entry Barrier

Novelty: The processing method and the facility we developed areoriginal. There doesn't exhibit any similar technique in the current market.

Good patent portfolio: 10 granted patents, 8 filed patents. The range of our patents include the fabrication instruments, key components, the fabrication method of semi-conductor devices.

Partnership: We cooperate with many semiconductor manufacturers, which can pro-vide samples to optimize the enhancement process.

Market Scope

The market segments we aim are power devices (GaN, SiC), niche-type light-emitting components (mini-LED, micro-LED, UVC-LED), communication components, <7nm FinFET.The Semiconductor Equipment and Materials International (SEMI) released a report "Power and Compound Semiconductor Factory Outlook". It highlights particular compound materials that have been adopted in semiconductor fabs.From 2017 to 2022, 16 semiconductor fabs will be built globally, and the overall production capacity will grow by 23%. TrendForce LED Research (LEDinside) reports that by 2022 Micro LED & Mini LED applications will account for 11% of the total LED wafer usage. Based on these market growth estimates, the total potential market for the next five years is estimated to be about 200 sets.